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This part of IEC 60664 details the conditions in which the reduction of clearance and creepage distances can apply to rigid assemblies such as printed boards or terminals of components.
Author | VDE |
---|---|
Editor | VDE |
Document type | Standard |
Format | Paper |
ICS | 29.080.01 : Electrical insulation in general
|
Number of pages | 28 |
Replace | DIN EN 60664-3 (2010-10) |
Cross references | EN 60664-3 (2017-06), IDT |
Weight(kg.) | 0.1476 |
Year | 2017 |
Document history | DIN EN 60664-3 (2017-11) |
Country | Germany |
Keyword | DIN EN 60664;EN 60664;EN 60664-3;60664 |