VDI 4476:2013-07

The RFID technology for logistics is increasingly important. The UHF technology in particular has taken an enormous step forward. The use and development of UHF transponders face the fundamental problem of the performance variation of single transponders. This emerging tolerance is attributed to the demanding process of connecting transponder antenna and chip (bonding), as well as the production-related tolerances of the electrical characteristics of these two main components. The guideline describes the procedure and the relevant measures for manufacturing, integrated testing and qualification of UHF transponders for the manufacturing process of the transponder inlays as well as for the conversion of transponder inlays to labels.